Search results for "gan led"

showing 3 items of 3 documents

Study and optimization of near UV InGaN/GaN based Light Emitting Diodes at low injection current regimes

2006

InGaN/GaN LEDs low injection currentSettore ING-INF/01 - Elettronica
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Effects of 5 MeV electron irradiation on deep traps and electroluminescence from near-UV InGaN/GaN single quantum well light-emitting diodes with and…

2020

The electrical properties, electroluminescence (EL) power output and deep trap spectra were studied before and after 5 MeV electron irradiation of near-UV single-quantum-well (SQW) light-emitting diodes (LED) structures differing by the presence or absence of InAlN superlattice underlayers (InAlN SL UL). The presence of the underlayer is found to remarkably increase the EL output power and the radiation tolerance of LEDs, which correlates with a much lower and more slowly changing density of deep traps in the QW region with radiation dose, and the higher lifetime of charge carriers, manifested by higher short-circuit current and open-circuit voltage in current–voltage characteristics under …

Materials scienceAcoustics and UltrasonicsSuperlattice02 engineering and technologyElectroluminescence01 natural sciencesSettore ING-INF/01 - ElettronicaSettore FIS/03 - Fisica Della Materiagan ledlaw.inventionelectroluminescencelaw0103 physical sciencesElectron beam processingluminescenceQuantum wellDiode010302 applied physicsbusiness.industryradiation tolerancesuperlatticeSemiconductor device021001 nanoscience & nanotechnologyCondensed Matter PhysicsSurfaces Coatings and FilmsElectronic Optical and Magnetic MaterialsOptoelectronicsCharge carrier0210 nano-technologybusinessLight-emitting diode
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First InGaN/GaN thin Film LED using SiCOI engineered substrate

2006

InGaN / GaN multiple quantum well (MQW) light emitting diodes (LEDs) were deposited by metal-organic chemical vapor deposition (MOCVD) onto SiCOI engineered substrates. SiCOI substrates are composed of SiC thin film transferred on a silicon substrate through silicon oxide layer by the Smart Cut™ technology. LEDs structures grown on SiCOI were characterized, then transferred onto Si substrates via a metallic bonding process and SiCOI substrates were removed. Three different metallic stacks were used for metallic bonding, including mirror and barrier diffusion. Vertical thin film LED obtained were characterized and showed a 2 to 3 times increase of external quantum efficiency. These results d…

Materials scienceSiliconbusiness.industrychemistry.chemical_elementChemical vapor depositionGallium nitrideCondensed Matter PhysicsSettore ING-INF/01 - ElettronicaLight emitting diodeslaw.inventionchemistrylawOptoelectronicsQuantum efficiencyInGaN/GaN LEDs SiCOI technologyMetalorganic vapour phase epitaxyThin filmbusinessSilicon oxideLight-emitting diodeMetallic bondingefficiency LEE
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